NGAC TC907-09
Thermally Conductive and Electrically Insulating Adhesive
To request a FREE sample of NGAC TC907-09, complete the form or email us directly at info@nextgenadhesives.com.
DESCRIPTION:
NGAC TC907-09 is a medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications
ADVANTAGES AND APPLICATIONS:
NGAC TC907-09 provides strong and high impact bonds which improve heat transfer while maintaining electrical insulation. It bonds to a wide range of substrates including metals, glass and plastics. The NGAC TC907-09 has a low coefficient of thermal expansion and will provide excellent resistance to mismatched substrates and very low shrinkage. Additionally, the NGAC TC907- 09 is highly resistant to chemicals.
NGAC TC907-09 features the following characteristics that enable ease of use.
Shelf life of each lot will be exactly 6 months from date of manufacture with storage at -40°C Minimum.
NGAC TC907-09 features the following characteristics that enable ease of use.
PROPERTIES:
*All values reported below are typical values and are for reference use only. These values are not intended for use in developing specifications. Application testing under specific conditions should be performed to determine actual results and fitness for use.
COLOR (mixed): Black
MIXED VISCOSITY, cps: 13,000
SPECIFIC GRAVITY: 1.70
MIX RATIO BY WEIGHT (R/H): 100/5.2
HARDNESS, Shore D: 90D
OPERATING TEMPERATURE: -70 to +125˚C
GLASS TRANSITION TEMPERATURE: 120°C
THERMAL CONDUCTIVITY, W/M/°K: 0.56
CTE, cm/cm/°C: 5.09E-05
PERCENT SOLIDS: 100%
WORKING LIFE***: 30 minutes
***Working life is subjective to appication requirements
CURE SCHEDULE:
Temperature of 25˚C for 72 hours
OR
Temperature of 65˚C for 2 hours
OR
Temperature of 95°C for 1 hour
For additional information or assistance, please call 978-436-9600.
ADDITIONAL ELECTRONIC ADHESIVE PRODUCTS
